IEEE International Conference on PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE)
November 12 – 14, 2024
Marriott at the Space & Rocket Center – Huntsville, AL
PAINE 2023 Winners
Best Paper
A sense of self for power side-channel signatures: Time-
series
Side-channel Disassembler (TSD) and Integrity Monitor
(TSD-IM)
Random Gwinn
Johns Hopkins University – Applied Physics Laboratory
Best Lab Demo
Secured Embedded Architecture Laboratory(SEAL)
Director: Debdeep Mukhopadhyay
Video 1
Indian Institute of Technology Kharagpur – India
Best Poster
Experimental Characterization of Two-Photon Optical Beam Induced Current Imaging for Microelectronics Assurance
Ryan J. Patton, Anthony George, Adam Kimura, Jamin McCue
Battelle Memorial Institute – Air Force Research Laboratory
About PAINE
Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications is making them increasingly vulnerable to various forms of threats and inspection. Large industry and government efforts have been put in place across the globe to address related supply chain security problems to offer solutions, training, and services. The number of programs introduced by the US government has increased over the years to analyze and develop relevant solutions. Although much focus is given to the digital domain, physical assurance and inspection of electronics as well as physical fingerprinting based on analog parameters are rapidly providing opportunities for unique countermeasures.
PAINE conference provides a unique venue for all researchers and practitioners from academia, industry, and government to have productive dialog on such topics. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. PAINE covers the broad topic of hardware security and trust; example topics of interest include but are not limited to:
Topics to be Covered:
- Security primitives: Novel devices, materials, and systems
- New metrologies for characterization and assurance
- Test vehicles and performance quantification
- Additive manufacturing assurance for electronics
- Physical and design interface assurance
- Trojans and backdoors: Detection and prevention
- Workforce Development
- Advanced packaging and heterogenous integration
- Fault injection assessment and countermeasures
- Side channel assessment (power, timing, EM) for assurance and countermeasures
- Analog & mixed-signal circuits and systems security
- FPGA Bitstream protection and vulnerabilities
- Emerging topics in physical inspection and assurance
- Counterfeit Detection and Anti-Counterfeit Technique
- Image analysis and artificial intelligence for assurance and inspection
- Novel material and devices for assurance
- Sample Preparation
- PCB trust and assurance
- Chip and PCB level decomposition for assurance
- FIB/SEM for assurance
- Electro-optical probing using PEM, EOP, EOFM, etc.
- Physical/side channel fingerprinting
- Mod-chip on PCB
- Microprobing and nanoprobing
- Bus-snooping
- Field-based weakness
- Countermeasures against tampering and decomposition
- Metrologies characterization
- Functionality validation
- Process improvements
- Failure analysis and fault isolation
- Automated inspection for advanced packaging
- Physical/logical shielding etc.